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Samsung Electro-Mechanics Expands Partnership with Qualcomm for FC-BGA Package Substrate Production, Extending Collaboration to Data Center Business

2026.06.22 13:47:35

On June 22, Samsung Electro-Mechanics kicked off mass production of packaging substrates for Qualcomm’s first data-center AI accelerator at its Busan factory. This marks an expansion of the two companies’ partnership, moving beyond their traditional collaboration in mobile and PC markets to now cover the data center sector. Samsung Electro-Mechanics recently began mass production of Flip Chip Ball Grid Array (FC-BGA) packaging substrates tailored for Qualcomm’s latest AI accelerator, the AI200. The AI200 is Qualcomm’s first AI accelerator built for data centers, unveiled last October, and it’s primarily designed for AI inference scenarios. The chip features Qualcomm’s self-developed Oryon CPU and Hexagon NPU, paired with low-power LPDDR5 memory to enhance energy efficiency. Qualcomm plans to launch the AI200 in the second half of this year, so Samsung Electro-Mechanics started mass production of the FC-BGA substrates early to align with the product’s rollout timeline. This development signals that the two companies’ collaboration in the AI chip supply chain is accelerating toward data center infrastructure. For real-time monitoring of global AI hotspots and 24/7 news updates, click the original link to join BlockBeats’ Feishu AI News Channel.
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