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T. Rowe Price: The next wave of AI opportunities may lie further upstream in the supply chain.

1 hours ago

T. Rowe Price portfolio specialist Amanda Ng noted in a report that the next phase of AI-related investment opportunities may lie further upstream in the supply chain, rather than the highly hyped AI platforms or chipmakers. She pointed out that areas like advanced packaging, semiconductor substrates, and high-end printed circuit boards (PCBs) are growing increasingly critical. While these components account for a relatively small share of the total bill of materials (BOM) required for AI, they could still become key bottlenecks. She also added that even a modest price increase for these products could significantly boost manufacturers' profits while remaining affordable for end customers.

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