AMD and Samsung are nearing completion of a large-scale HBM4 supply contract, with Helios expected to ship by the end of the third quarter.
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According to a report by Seoul Economic Daily, AMD CEO Lisa Su stated that negotiations between the company and Samsung Electronics for a formal contract on large-scale HBM4 supply are "nearing completion". In March this year, the two sides signed a memorandum of cooperation, which includes Samsung prioritizing HBM4 supply to AMD’s new-generation AI accelerators and advancing wafer foundry collaboration. Su said at the "AMD Advancing AI 2026" event that the AI server rack system Helios has entered full mass production and is expected to start shipping from the end of the third quarter. With Helios’ launch, AMD is discussing specific contracts with Samsung for further expanding HBM4 supply. Han Jin-man, head of Samsung Electronics’ wafer foundry business, and Cho Sang-yeon, head of the Americas semiconductor business, attended the event, and after their speeches, held follow-up meetings with AMD executives including CTO Joseph Macri. The two Samsung executives noted an important meeting will be held soon, but did not give specific responses on subsequent HBM4 contract matters. When asked about future HBM supply and the possibility of AMD chips being manufactured by Samsung, Macri only said the two sides maintain a "cooperative relationship".
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