Samsung Electronics has unveiled its next-generation lithography technology roadmap, and will deploy high-NA EUV in mass production at the 1nm node.

Samsung Electronics technical expert Park Chang-min announced at the 2026 NGL Conference that Samsung plans to introduce a major lithography technology innovation for its 1-nanometer process, which could enter mass production as early as 2030. The company intends to deploy high-NA EUV — a next-generation extreme ultraviolet lithography technology — in large-scale production at the 1nm node, and is currently focused on developing the technologies required for commercialization. Separately, Samsung is accelerating development of high-NA EUV, the successor to current EUV technology. The firm has set its sights on full-scale mass production deployment of its 1nm (or A10) process. "A" denotes angstrom, with 1 angstrom equal to 0.1nm. Per this roadmap, Samsung expects to begin using high-NA EUV in mass production around 2030. The company has already commercialized its 2nm process and plans to launch mass production of its 1.4nm SF1.4 process in 2029. According to reports, it is preparing to start mass production of SF1.4+ — an enhanced variant of the 1.4nm process — and its 1nm process in 2030.