Qualcomm and Amazon strike a multi-generational partnership to jointly develop custom chips for AI data centers.

Qualcomm (QCOM.O) announced today a multi-generational partnership with Amazon (AMZN.O) to provide customized chips for large-scale AI data centers and jointly advance AI inference. The two sides are also collaborating on developing optical interconnect solutions with speeds up to 1.6T and for future generations. Qualcomm plans to deepen its use of AWS AI infrastructure (including Amazon Bedrock) for electronic design automation (EDA) workloads, with the goal of shortening chip design cycles. Cristiano Amon, president and CEO of Qualcomm, stated that amid accelerating AI demand, data center infrastructure needs breakthroughs in both computing and connectivity, adding that Qualcomm is pleased to partner with AWS on customized chips and connectivity solutions. Prasad Kalyanaraman, vice president of AWS, said the collaboration builds on a strong partnership, with both sides working together to deliver more efficient and cost-effective infrastructure for customers.